Carbon-coated Copper Foil SU004-1/2
SU004-1/2 acts as a heat conduction device, forming a good heat conduction path between the heating element and the heat sink member, and forming a heat dissipation module together with the heat sink and the structural fixing member (fan).
Product Description
SU004-1/2 Carbon-coated Copper Foil acts as a heat conduction device, forming a good heat conduction path between the heating element and the heat sink member, and forming a heat dissipation module together with the heat sink and the structural fixing member (fan)
Applications
◆ Computer, web server
◆ Communication equipment
◆ Electric appliance
◆ LED lighting equipment
| SU004-1/2 | ||
| Item | Test | Test method |
| Copper foil thickness （mm) | 0.025±0.005 | ASTM D374 |
| Coating thickness （mm) | 0.003±0.001 | ASTM D374 |
| Total thickness （mm) | 0.04±0.005 | ASTM D374 |
| Proportion （g/cm3) | 7.70±0.50 | ASTM D792 |
| Temperature range （℃） | ‘-40-200 | *** |
| Thermal Conductivity （W/m-K） | 400 | ASTM D5470 |
| Resistance （Ω.cm) | ≤0.02 | ASTM D257 |
| Adhesion （kgf/inch) | >0.6 | GB/T 2792-1998 |
| Printability | Nano carbon coating | *** |
| Width （mm) | 380mm;500mm;600mm | Base of copper substrate |
| Length （M) | 50M/ volume | *** |
| RoHS | PASS | IEC 62321 |
| Halogen | PASS | EN14582 |
| REACH | PASS | EN14372 |
| SU series Carbon-coated Copper Foil | |||
| Carbon-coated Copper Foil | Thermal conductivity@XY(W/m.k) | Printability | Toatal thickness(mm) |
| SU004-1/2 | 400 | Nano carbon coating | 0.04±0.005 |
| SU005-1/2 | 400 | Nano carbon coating | 0.05±0.005 |
| SU006-1/2 | 400 | Nano carbon coating | 0.06±0.005 |
| SU010-1/2 | 400 | Nano carbon coating | 0.085±0.005 |
| SU085-1/2 | 400 | Nano carbon coating | 0.10±0.005 |
Principles of Thermal Interface Material
1. There are three modes of heat transfer: conduction, convection, and radiation.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
Thermal Interface Material(TIM)
