Key Application • Industrial Power
Thermal Interface & Insulation Materials for Industrial Power Electronics
For UPS, AC-DC/DC-DC power stages, inverters/VFDs, and servo drives, Sheen materials help reduce interface thermal resistance.
improve electrical insulation safety, and enhance manufacturability (die-cut parts and automation-ready formats).
Recommended for: IGBT/MOSFET/SiC power modules, transformers/inductors, control boards and heat sink interfaces.
Design challenges in industrial power
High heat flux & hotspots
Power devices operate at high power density; interface thermal resistance directly impacts junction temperature margin.
Low interface resistance
Stable performance
Electrical insulation first
Dielectric strength and insulation reliability often become the key deciding factor for module-to-heat-sink interfaces.
Dielectric strength
Safety margin
Tolerance & manufacturability
Flatness and height variation require gap management; production needs die-cut parts or dispensable solutions for consistency.
Die-cut
Dispensing
Repeatability
System map (where TIMs are applied)
UPS
Insulation + thermal transfer for power stages and heat sinks; focus on stability through thermal cycling.
Insulation sheet
Pads/Gels
AC-DC / PFC Stage
IGBT/MOSFET interfaces to cast aluminum or heat sinks; dielectric strength is often a critical requirement.
Insulation
PCM/Grease
DC-DC Converters
Complex gaps and height differences; automation-ready dispensing improves thickness and shape control.
Thermal gel
Low stress
Inverter / VFD
Power module interfaces require low thermal resistance and stable insulation; gap tolerance depends on the flatness stack-up.
Pads
PCM
Servo Drives
Board-to-housing conduction paths; prioritize controlled compression to protect PCB and packages.
Pads
Tack options
Power Modules
IGBT/SiC/GaN module-level thermal path design; dielectric and reliability screening drive final selection.
Insulation sheet
Validation
Solutions by interface (engineer-ready)
Below are typical subsystem-level selections.
Different project solutions require different model selections. Please consult our engineers to determine the appropriate product model.
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Recommended Silicone-free thermal pads (AF series) for silicone-sensitive assemblies; Silicone pads (SF) where maximum conductivity/temperature range is needed.
- : silicone-free pads reduce risk of low-molecular siloxane migration.
- : select Shore 00 class matched to clamp load to avoid warpage and stress transfer.
Recommended Thermal gels (SE series, 2.0–10.0 W/m·K) for controlled dispensing; pair with pads for hybrid interfaces.
- : compatible with dispensing, screen printing or doctor-blade coating (automation-friendly).
- : gels improve wetting on micro-rough surfaces and reduce interface thermal resistance.
Recommended Phase change materials for heat sink/cold plate interfaces (≈50–52°C activation), or high-k pads where thicker gaps exist.
- : low thermal resistance after phase transition; natural tack simplifies handling.
- : gap tolerance for tolerance stack-ups; optional carriers (PI/fiberglass) improve handling.
Goal: dielectric safety + low thermal resistance + repeatable bolt-down assembly.
Recommended Thermal insulation sheets (fiberglass or PI carrier) to provide high mechanical strength and electrical insulation, combined with PCM/grease or tailored pads depending on flatness and maintenance/rework strategy.
- When dielectric dominates: specify dielectric target (VAC or kV/mm) early; confirm creepage/clearance constraints.
- When rework matters: PCM offers low interface resistance with clean handling; grease is for ultra-low BLT but needs process control.
- Deliverables: pre-cut insulation parts, sheets/rolls, and edge control to prevent overhang.
Goal: fill complex gaps, reduce assembly stress, support automation.
Recommended： Thermal gels for controlled dispensing (thickness/shape control), especially when component height variation is significant.
- Automation-ready: dispensing enables stable thickness and repeatable coverage across a production line.
- Low stress: gels are suitable for fragile components or large tolerance stack-ups.
Goal: transfer heat to housing while minimizing board warpage.
Recommended： Thermal pads selected by measured gap and available clamp load; specify tack and carrier options as needed.
- Gap-defined designs: pads provide fast assembly and repeatable performance (sheet or die-cut).
- Production: die-cut parts improve alignment and prevent contamination from overhang.
Goal: reduce siloxane migration/contamination risks while maintaining insulation and mechanical robustness.
Recommended： Silicone-free thermal pads when your system design or adjacent components require minimized volatile silicone concerns.
- Use case: high-end industrial controls, contamination-sensitive electronics, and reliability-driven designs.
- Selection: match compressibility to clamp load; avoid overstress and ensure stable contact.
Recommended Pads (SF) for ECU/cockpit modules; gels for radar modules and height differences; consider EMI + thermal co-design where required.
- : prioritize controlled wetting, low stress, and stable performance at elevated ambient temperatures.
- : focus on space optimization and stable thermal performance under constrained airflow.
Recommended Pads and PCMs for module-to-cold-plate interfaces; gels for complex gaps; sealing foams for enclosure integrity.
- : focus on stable impedance through temperature cycles and robust manufacturing flow.
- : include sealing/damping material to reduce vibration damage and prevent dust/moisture ingress.
Selection table (fields for engineering & procurement)
Copy this table into your RFQ email to accelerate material matching and sampling.
| Category | Fields to provide | Typical examples |
|---|---|---|
| Subsystem & device | Subsystem; device type; interface location | UPS / AC-DC / DC-DC / Inverter; IGBT / SiC; module-to-heat-sink |
| Thermal | Target W/m·K or target thermal resistance; contact area; power loss (optional) | Target low interface resistance; 40×40mm |
| Mechanical | Gap min/max; target BLT; clamp load/pressure; stress constraints | Gap 1.2–2.0mm; clamp load limited by PCB |
| Electrical | Dielectric requirement; insulation constraints; flame rating | Dielectric target (VAC/kV/mm); UL94 requirement if any |
| Environment | Operating temperature, humidity/aging expectations | -40 to 125°C; thermal cycling |
| Manufacturing | Format; tack; carrier; rework; volume & lead time | Die-cut + single-side tack; PI carrier; 50k/yr |
FAQ (Industrial Power)
Choose based on gap definition and manufacturability.
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Use pads for defined gaps and fast repeatable assembly. Use gels for complex interfaces and large height variation where dispensing controls thickness and shape.
Insulation can be the key deciding factor.
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Industrial power designs often require the interface material to provide electrical insulation while transferring heat to the heat sink/cold plate, making dielectric strength a primary selection constraint.
For silicone migration/contamination risk control.
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Specify silicone-free pads when your system is contamination-sensitive or when long-term reliability requirements require minimized volatile silicone concerns in enclosed assemblies.
Production-grade deliverables.
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Yes. Typical deliverables include sheets, rolls, die-cut parts, and cartridges for automated dispensing; tack and carrier options can be specified for assembly stability and rework.