Application-focused Thermal Management Solutions
Sheen provides reliable thermal interface materials and foamed silicone solutions, helping engineers solve heat dissipation, insulation, and reliability challenges across diverse industries.
Industry Applications
Industry Applications of Thermal Management Solutions
Sheen Technology is a leading provider of industrial thermal management solutions.
With over 18 years of manufacturing experience, advanced R&D capabilities, and a professional engineering team, Sheen delivers high-performance thermal materials for demanding applications.
Our diverse product portfolio and flexible customization services help global manufacturers solve heat dissipation challenges, improving reliability, performance, and product lifespan across existing and emerging technologies.
With over 18 years of manufacturing experience, advanced R&D capabilities, and a professional engineering team, Sheen delivers high-performance thermal materials for demanding applications.
Our diverse product portfolio and flexible customization services help global manufacturers solve heat dissipation challenges, improving reliability, performance, and product lifespan across existing and emerging technologies.
Find out more about some of the industries that use our products by clicking the tiles below:
Consumer Electronics
Thermal pads & gels for compact devices—reduce hotspots and improve performance stability.
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Telecom & Data Center
Reliable TIMs for routers/servers—lower junction temps and support 24/7 uptime.
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EV & Energy Storage
Gap fillers and foamed silicone for battery packs—enhance safety and thermal consistency.
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Industrial Power
High-reliability TIMs for IGBT/inverters—handle high power density and harsh conditions.
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LED Lighting
Thermal tapes/adhesives for LED modules—fast assembly with stable heat dissipation.
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Medical Devices
Compliance-ready thermal materials—support long-life, low-noise, and reliable operation.
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Automotive Electronics
Automotive-grade thermal solutions—resist vibration, cycling, and temperature extremes.
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Robots
Robots are becoming more and more common in everyday life.
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Renewable Energy
TIMs for PV inverters/chargers—improve thermal efficiency and long-term reliability
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Application Scenarios of Thermal Conductive Materials（Overviews）
5G Communication
The main heat sources in optical modules are located near the PCB chips and optical components (TOSA and ROSA). The main challenge in cooling the chips on the main board is that, in the case of daughterboards or single boards, the high-heat-generating components are on the bottom surface, preventing the heat from being efficiently transferred to the main heat dissipation surface.
To solve the heat dissipation problem of optical modules, both thermal conduction and heat dissipation must meet the necessary conditions.
For cooling the chip area, soft, compressible, high-thermal-conductivity materials are primarily used, such as SF1000 thermal silicone pads. Their high thermal conductivity, low stress, low volatility, and low contact resistance make them suitable for optical module heat dissipation solutions.
To solve the heat dissipation problem of optical modules, both thermal conduction and heat dissipation must meet the necessary conditions.
For cooling the chip area, soft, compressible, high-thermal-conductivity materials are primarily used, such as SF1000 thermal silicone pads. Their high thermal conductivity, low stress, low volatility, and low contact resistance make them suitable for optical module heat dissipation solutions.
Near the optical components, thermal interface materials can be selected based on different packaging methods.
Sheen’s silicone-free thermal interface materials, such as the AF600D silicone-free thermal pad and the SP205A-35 thermal phase change material, can meet the requirements.
And prevent silicone oil leakage from silicone-containing thermal products during long-term operation, which can lead to a decrease in optical module performance.
Sheen’s silicone-free thermal interface materials, such as the AF600D silicone-free thermal pad and the SP205A-35 thermal phase change material, can meet the requirements.
And prevent silicone oil leakage from silicone-containing thermal products during long-term operation, which can lead to a decrease in optical module performance.
Applicable Materials: High Thermal Conductivity Silicone Sheets, Silicone-Free Thermal Pads, Thermal Phase Change Materials
Communication Base Station
Currently, the main cooling solution for base stations is a closed-loop natural convection system, which transfers heat to the external environment through a thermal interface material.
The SF1000 thermal conductive silicone sheet can be used for this purpose. This material is specifically designed as a thermal interface material for communication equipment base stations, solving the heat dissipation problems of processors and FPGAs. It has a thermal conductivity of 10 W/mK and features ultra-softness, low volatility, and low oil bleeding.
The SE60 thermal conductive gel offers excellent wettability, ultra-low contact thermal resistance, and superior cooling performance. Its ultra-low stress and variable thickness make it ideal for the compact structure of 5G base stations.
It can be applied to various irregularly shaped surfaces without sagging and is compatible with automated equipment, significantly increasing production efficiency.
The SF1000 thermal conductive silicone sheet can be used for this purpose. This material is specifically designed as a thermal interface material for communication equipment base stations, solving the heat dissipation problems of processors and FPGAs. It has a thermal conductivity of 10 W/mK and features ultra-softness, low volatility, and low oil bleeding.
The SE60 thermal conductive gel offers excellent wettability, ultra-low contact thermal resistance, and superior cooling performance. Its ultra-low stress and variable thickness make it ideal for the compact structure of 5G base stations.
It can be applied to various irregularly shaped surfaces without sagging and is compatible with automated equipment, significantly increasing production efficiency.
Applicable Materials: thermal conductive silicone sheets, thermal conductive gels, thermal conductive grease, thermal insulating sheets, thermal phase change materials, etc.
Consumer Electronics
Consumer products such as smartphones, tablets, smart wearables, laptops, and drones are developing towards miniaturization, lightweight design, and increased intelligence.
High integration, big data processing, and CPU power consumption lead to increased heat generation, causing devices to slow down.
The innovation and upgrading of consumer electronics place higher demands on thermal management materials. Electronic products such as smartphones are becoming increasingly complex in functionality, with improved performance in computing, display, and storage. The integration and density of chips and modules are increasing dramatically, leading to a continuous increase in the power consumption and heat density of electronic products.
Efficient heat dissipation has become one of the important considerations in the design and development of electronic products.
High integration, big data processing, and CPU power consumption lead to increased heat generation, causing devices to slow down.
The innovation and upgrading of consumer electronics place higher demands on thermal management materials. Electronic products such as smartphones are becoming increasingly complex in functionality, with improved performance in computing, display, and storage. The integration and density of chips and modules are increasing dramatically, leading to a continuous increase in the power consumption and heat density of electronic products.
Efficient heat dissipation has become one of the important considerations in the design and development of electronic products.
Applications:
Applicable Materials: thermal conductive silicone sheets, thermal conductive gels, thermal conductive grease, thermal insulating sheets, thermal phase change materials, etc.
Consumer Electronics–Cell Phone
Display screen categories:
* Explosion-proof film (3D);
* Protective film (2D);
* Silver paste;
* ITO Film;
* OCA;
* Frame adhesive (foam adhesive/VHB);
* White glue;
* Backlight film materials
* Explosion-proof film (3D);
* Protective film (2D);
* Silver paste;
* ITO Film;
* OCA;
* Frame adhesive (foam adhesive/VHB);
* White glue;
* Backlight film materials
FPC (Flexible Printed Circuit):
Electromagnetic shielding film;
PI coverlay film;
FCCL (Flexible Copper Clad Laminate);
ACF/CBF (Anisotropic Conductive Film/Conductive Bonding Film);
Conductive fabric tape/Conductive non-woven fabric tape;
PET double-sided adhesive tape;
PI high-temperature adhesive tape;
Dry film (process)
Electromagnetic shielding film;
PI coverlay film;
FCCL (Flexible Copper Clad Laminate);
ACF/CBF (Anisotropic Conductive Film/Conductive Bonding Film);
Conductive fabric tape/Conductive non-woven fabric tape;
PET double-sided adhesive tape;
PI high-temperature adhesive tape;
Dry film (process)
Battery Cover:
IML/IMD In-mold injection molding;
Deco Film;
PC & PMMA composite materials;
Electromagnetic wave absorbing material (NFCI wireless charging);
Graphite sheet/nanocarbon copper;
Ultra-thin PET double-sided adhesive tape/black film
IML/IMD In-mold injection molding;
Deco Film;
PC & PMMA composite materials;
Electromagnetic wave absorbing material (NFCI wireless charging);
Graphite sheet/nanocarbon copper;
Ultra-thin PET double-sided adhesive tape/black film
PCB:
Graphite sheet/copper foil/nanocarbon copper;
Conductive fabric tape, conductive non-woven fabric tape, conductive foam;
Double-sided tape;
PI/PET tape;
Thermal conductive gel/thermal pad;
PORON/mesh
Graphite sheet/copper foil/nanocarbon copper;
Conductive fabric tape, conductive non-woven fabric tape, conductive foam;
Double-sided tape;
PI/PET tape;
Thermal conductive gel/thermal pad;
PORON/mesh
Lithium-ion Battery:
Copper foil/aluminum foil;
Separator;
Graphite/lithium cobalt oxide/electrolyte;
Aluminum-plastic film;
OPP tape/PET tape/PI;
Adhesive tape;
Outer packaging with printable label
Copper foil/aluminum foil;
Separator;
Graphite/lithium cobalt oxide/electrolyte;
Aluminum-plastic film;
OPP tape/PET tape/PI;
Adhesive tape;
Outer packaging with printable label
High Heat Generation
High power density in components leads to thermal accumulation and performance degradation.
Mechanical Tolerance & Gaps
Uneven surfaces and assembly tolerances require compliant thermal materials.
Environmental Stress
Temperature cycling, vibration, and aging challenge long-term material reliability.
Sheen’s Solution Strategy for Industry
Step 1 – Thermal Analysis
Evaluate heat sources, power density, and heat flow paths.
Step 2 – Material Matching
Select or customize thermal pads, gels, or foamed silicone based on application needs.
Step 3 – Validation & Optimization
Verify performance through testing and iterative optimization.
Recommended Thermal Materials
| Material Type | Typical Location | Key Benefit |
|---|---|---|
| Thermal Pad | Between heat source & heat sink | Stable heat transfer |
| Thermal Gel / PCM | Complex or uneven gaps | Excellent gap filling |
| Foamed Silicone | Enclosure & insulation areas | Cushioning & sealing |
| Insulation Material | Electrical isolation zones | Between the heat source & heat sink |
Application Case Study
Excessive temperature rise affected system stability and lifetime
Solution:
Sheen applied customized thermal interface materials and foamed silicone components
Sheen applied customized thermal interface materials and foamed silicone components
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Design Systems
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Best Animation System
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20°C
Temperature reduced by
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120k+
Improved long-term reliability
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120k+
Stable mass production achieved
Feature #1
Application analysis & consultation
Feature #2
Material customization & sampling
Feature #3
Thermal testing & reliability validation
Feature #4
Mass production and quality control support
Start Your Thermal Project with Sheen
Share your application details with our engineers
and receive a tailored thermal solution.
Contact Us Now!
and receive a tailored thermal solution.