SR600-A-B Graphite Film
The SR600-A-B graphite pad is a synthetic graphite film with a unique layered structure and crystal orientation with superconductivity in the planar direction. This model is wrapped in a black PET film, which can be die-cut in various shapes and covered to prevent the circuit from falling out of the graphite.
The SR600-A-B product is a graphite pad with a unique layered structure and crystal orientation with superconductivity in the planar direction. This model is wrapped in a black PET film, which can be die-cut in various shapes and covered to prevent the circuit from falling out of the graphite.
Product Parameters
| SR600-A-B | ||
| Item | Test | Test method |
| Protective film color | Black | Visual |
| Total thickness （mm) | 0.06±0.003 | ASTM D374 |
| Graphite substrate thickness （mm) | 0.025 | ASTM D374 |
| Ingredient | Black PET film、 Artificial graphite | *** |
| Insulating adhesive tape | Yes | *** |
| Density (g/cm3) | 1.7~2.0 | ASTM D792 |
| Thermal Conductivity @XY(W/m.k) | 1500 | ASTM E1461 |
| Thermal Conductivity @Z(W/m.k) | >30 | ASTM E1461 |
| Heat (J/g.k) | 0.85 | *** |
| Proper temperature （℃） | -40 to 130 | *** |
| RoHS | PASS | IEC 62321 |
| Halogen | PASS | EN14582 |
| REACH | PASS | EN14372 |
| SR series Graphite Sheet | |||||
| Sheen Graphite Sheet | Thermal conductivity@XY(W/m.k) | Thermal conductivity@Z(W/m.k) | Total thickness | Ingredient | Insulating adhesive |
| SR600-A-B | 1500 | >30 | 0.06±0.003 | Black PET film, artificial graphite | Yes |
| SR600-A-P | 1500 | >30 | 0.17±0.003 | Artificial graphite, PET tape, foam | / |
| SR600-A-W | 1500 | >30 | 0.065±0.003 | White PET film， graphite | Yes |
Principles of Thermal Interface Material
1. There are three modes of heat transfer: conduction, convection, and radiation.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
Thermal Interface Material(TIM)
