Thermal Film 0.9W/mK
SC800-PI-2-K4 0.9 W/m·K Thermal Film use polyimide film as the reinforcement carrier. This carrier is coated on both sides with a mixture of thermal conductive filler and silicone, efficiently conducting heat while providing high mechanical strength and excellent electrical insulation properties.
The SHEEN’s SC Series Thermal Films are renowned for their distinctive characteristics, which include:
◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m·K.
◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier.
◆ High mechanical strength and excellent electrical insulation properties.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m·K.
◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier.
◆ High mechanical strength and excellent electrical insulation properties.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
【Applications】
◆ Uninterruptible Power Supplies (UPS)
◆ MOSFETs
◆ Switching power supplies
◆ Power amplifiers
◆ Electric vehicle motor controllers
Properties
| Properties | Unit | SC800-PI-2-K4 | Test Method |
|---|---|---|---|
| Color | – | Gray | Visual |
| Reinforcement Carrier | – | Polyimide | – |
| Thermal Conductivity | W/m·K | 0.9 | ASTM D5470 |
| Thickness | mm | 0.15±0.02 | ASTM D374 |
| Standard Hardness | Shore A | 90±5 | ASTM D2240 |
| Elongation | % | 40 | ASTM D412 |
| Tensile Strength | psi | 35 | ASTM D412 |
| Breakdown Voltage(@AC) | kV | ＞ 4.0 | ASTM D149 |
| Dielectric Constant (@1MHz) | – | 5.0 | ASTM D150 |
| Volume Resistivity | Ω·cm | 1*1012 | ASTM D257 |
| Operating Temp. | ℃ | -50 ~ 200 | – |
| Flame Rating | – | V-0 | UL94 |
| RoHS | – | PASS | IEC 62321 |
| Halogen | – | PASS | EN 14582 |
| REACH | – | PASS | EN 14372 |
Principles of Thermal Interface Material
1. There are three modes of heat transfer: conduction, convection, and radiation.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
Thermal Interface Material(TIM)
