Application Field • Automotive Electronics
Thermal Interface Materials for Automotive Electronics
Automotive ECUs, domain controllers, radar/camera modules and power electronics operate under temperature cycling, vibration and tight mechanical tolerance. Sheen provides silicone thermal pads, silicone-free pads, thermal gel, thermal grease, thermal conductive adhesives and potting compounds to lower interface thermal resistance, stabilize contact across tolerance stack-up, and support repeatable manufacturing (die-cut parts, dispensing/printing, and scalable supply).
Lower interface thermal resistance
Gap & pressure window
Cycling / aging stability
Die-cut / dispensing ready
If your focus is high-voltage traction inverter / OBC / battery pack interfaces, see: EV & Energy Storage
Stable performance under cycling
Choose compliant gap fillers that maintain contact across tolerance stack-up and cycling profiles.
Process-ready: die-cut & dispensing
Pads for fast placement; gel/grease for thin bond lines and complex geometry; potting for sealed protection.
Sourcing-friendly deliverables
Clear spec ranges, thickness windows, sample plan, and validation checklist aligned with automotive workflows.
Why Automotive Electronics Designs Overheat
Thermal cycling + vibration + tolerance stack-up
In vehicles, interface flatness and clamping force vary over time. Micro-voids and unevenness raise thermal resistance unless properly filled. The right TIM is defined by gap distribution (min/max) and allowable pressure window.
- Defined gap + fast placement → pads (sheet / die-cut)
- Uneven profile / large gap variation → gel (dispensing / printing)
- Ultra-thin bond line → grease / phase change
Protection + insulation + thermal path in sealed zones
Many automotive modules require environmental protection and electrical insulation while maintaining thermal conduction. Potting and adhesive choices should be tied to curing profile, rework strategy and dielectric targets.
Potting
Adhesives
Dielectric focus
Key Platforms & Hotspot Locations
Structured to match engineer/B2B search intent (platform → component → interface → material choice).
ECU / TCU / VCU (Control Units)
Hotspots: MCUs/SoC, power stages, regulators, memory. Interfaces: components → aluminum housing / spreader.
Pads
Grease / PCM
Adhesive
ADAS Domain Controller
Hotspots: SoC/DDR, PMIC, SSD, power modules. Interfaces to chassis or heatsink; consistency matters in mass production.
High-k pads
Gel for uneven gaps
Carbon fiber (heat path)
Radar / Camera Modules
Hotspots: RF/processing ICs, PMIC, shielded zones. For optics-adjacent designs, evaluate silicone restriction early.
Gel
Pads
Silicone-free (if required)
Product Parameter Matrix (Quick Comparison)
Designed for fast sourcing decisions: material family → conductivity range → thickness window → typical use → manufacturing notes.
| Material Family | Key Spec Ranges | Best Fit in Automotive Electronics | Manufacturing Notes |
|---|---|---|---|
| Silicone Thermal Pad (SF series) | 1.5–15.0 W/m·K; 0.3–10.0 mm; UL94 V-0; dielectric strength >6–>8 kV/mm (by grade); service temp up to -50~200°C (by grade). | ECU housing coupling, domain controller hotspots, power stages → chassis/heatsink | Sheets or die-cut parts; define compression window and thickness tolerance |
| Silicone-Free Pad (AF series) | 1.0–6.0 W/m·K; 0.5–5.0 mm (some grades 0.5–2.0 mm); -40~125°C (by grade). | Optics-adjacent / contamination-controlled zones (camera modules, silicone-sensitive designs) | Confirm restriction early; then finalize k/thickness/hardness by gap |
| Thermal Grease (SG560 series) | 1.0–5.0 W/m·K; min BLT 0.05 mm; -50~150°C. | Ultra-thin interfaces: SoC/processor → spreader/heatsink (with controlled application & rework plan) | Process control required; define coverage, squeeze-out control, and rework strategy |
| Phase Change Material (PCM) | 1.8–8.0 W/m·K; phase transition ~50–52°C; clean handling and “grease-like” interface performance. | Thin bond-line interfaces where process cleanliness and repeatability are priorities | Define activation temperature vs operating profile; confirm handling & storage |
| Thermal Conductive Adhesive (TIV800 series) | 1.0–2.0 W/m·K; tack-free 5–10 min; bond strength ≥1.5 MPa; -50~200°C. | Bonding where mechanical fixation is limited (heatsink/spreader bonding, local fixing) | Define cure condition, bond-line control, and serviceability |
| Thermal Potting (US-5201 series) | 0.8–3.5 W/m·K; dielectric strength >2.0 to >5.0 kV/mm (by grade); multiple cure schedules. | Sealed modules needing protection + insulation + thermal dissipation (controllers, sensors, power boxes) | Confirm flow/void control, cure profile, and rework strategy early |
| Carbon Fiber Thermal Pad | 15–45 W/m·K; thickness from 0.3 mm; some grades 30–45 W/m·K with 0.3–12.0 mm and -50~160°C. | Performance-driven thermal path design; targeted heat spreading / directional conduction stacks | Confirm mechanics, pressure window, and stack-up to leverage directionality |
Fast RFQ: platform, interface type, min/max gap, pressure window, target temperatures, silicone restriction (if any), and production method (die-cut / dispense / print / potting).
Reference U Cases
Use this section to match interface geometry and assembly process with the most stable material family.
ECU / Control Unit: Power Stage → Housing
- stable contact under cycling and vibration; controlled compression
- silicone pads (defined gap) or gel (uneven gap)
- thermal adhesive if mechanical fixation is limited
- die-cut shapes + thickness window + compression control plan
Radar / RF Module: Shielded Zone Interfaces
- fill complex micro-gaps and maintain thermal path consistency
- thermal gel for uneven profiles; pads for speed and defined gaps
- if optics-adjacent silicone restriction applies, shortlist silicone-free early
ADAS Domain Controller: SoC/DDR/PMIC Hotspots
- consistent assembly for high-volume production
- high-k pads (die-cut) + grease/PCM for thin interfaces where applicable
- carbon fiber pad in performance-driven stacks (mechanics & pressure defined)
Sealed Modules: Protection + Insulation + Thermal
- environmental protection, electrical insulation and heat dissipation
- thermal potting (flow/void + cure profile defined)
- dielectric target, cure time, rework strategy, and documentation
Reference “Case Data” (Material Mapping Examples)
Examples mapped from typical automotive modules to accelerate your selection and sampling plan.
ECU (Engine Control Unit)
- hotspots → housing/spreader
- SF500 / SF500-PI pads
- defined gap, fast placement, controlled compression
77GHz mmWave Radar
- RF/processing ICs → thermal path
- SE40 thermal gel + absorbing material stack
- complex geometry; gel fills uneven profiles
EOP (Electronic Oil Pump Controller)
- power electronics → housing
- SE30 thermal gel
- tolerance absorption, and stable thermal contact
For your internal build: add a 2–3 line “customer-style” summary for each module (challenge → interface → recommended family → procurement notes).
Validation Checklist
A simple, repeatable approach for engineering qualification. Keep documentation consistent for procurement review.
Engineering steps (recommended)
- 1) Define constraints: silicone restriction (if any), insulation target, service temperature
- 2) Gap mapping (min/max) + pressure window (torque/clamp limits)
- 3) Shortlist families: pad vs gel vs grease/PCM vs potting/adhesive
- 4) Build sample plan: 2–3 candidate grades + thickness options
- 5) Validate: steady-state + cycling profile aligned to your program
Quality & reliability backing
- Automotive-ready management system: ISO9001/ISO14001/IATF16949
- Reliability statement: 1000h thermal shock / 1000h 85°C/85%RH / 1000h high-temp aging
- Deliverables: TDS, process window, die-cut drawings, incoming QC points
Selection Table (RFQ Fields)
Copy-paste checklist to accelerate matching and sampling.
| Category | Fields to Provide | Why It Matters |
|---|---|---|
| Vehicle Domain | ADAS / body/powertrain / infotainment/gateway | Defines hotspot profile and reliability expectations |
| Module / ECU Type | ECU/TCU/VCU, radar, camera, domain controller, DC-DC, etc. | Determines interface geometry and process constraints |
| Interface | Heat source, interface location, contact area, substrates (Al/Cu/FR4/plastic) | Maps to the material family and thickness window |
| Gap & Mechanical | Gap min/max, target BLT, clamp pressure/torque limits, shock/vibration concerns | Drives pad softness vs gel selection and compression plan |
| Thermal Targets | Hotspot temperature limit, target case temperature, duty cycle | Determines required conductivity and bond-line strategy |
| Special Constraints | Silicone restriction (optics-adjacent), insulation/dielectric targets, sealing needs S | Shortlist silicone-free / potting / insulating stacks early |
| Manufacturing | Sheets/die-cut, dispensing/printing, potting kit; annual volume; documentation needs | Ensures repeatable assembly and procurement readiness |
FAQs about Automotive Electronics TIMs
Defined gaps vs uneven profiles.
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For defined gaps and fast placement, soft silicone pads are commonly used. If the profile is uneven or the gap variation is large, thermal gel is often preferred.
Final choice depends on gap mapping and allowable pressure window.
Tolerance absorption vs placement speed.
+
Use gel when you need tolerance absorption for uneven surfaces or multi-height components and want automated dispensing/printing.
Use pads when the gap is defined and you prioritize fast, repeatable placement (sheet or die-cut).
Optics-adjacent contamination control.
+
Specify silicone-free pads when silicone restriction or contamination control applies—commonly in optics-adjacent camera modules or silicone-sensitive zones.
Confirm restriction early, then finalize conductivity and thickness by gap distribution.
Process control and serviceability.
+
Both support thin bond lines. Grease can fit ultra-thin interfaces when application and rework are controlled.
PCM can be process-friendly with “cleaner” handling near operating temperature; choose based on your assembly method and rework strategy.
Protection + insulation + thermal path.
+
Potting is suitable for sealed modules needing environmental protection and electrical insulation while maintaining thermal dissipation.
Define flow/void control, cure profile and rework plan early, then select the target conductivity and dielectric grade.
Constraints → interface → gap → process.
+
Send: module type, interface location, contact area, gap min/max, clamp pressure/torque limits, target temperatures,
silicone restriction (if any), insulation/dielectric targets (if needed), and your preferred production method (die-cut / dispense / print / potting).