{"id":815,"date":"2025-12-22T02:07:23","date_gmt":"2025-12-22T02:07:23","guid":{"rendered":"https:\/\/www.sheen.technology\/?page_id=815"},"modified":"2025-12-22T02:32:47","modified_gmt":"2025-12-22T02:32:47","slug":"industrial-power","status":"publish","type":"page","link":"https:\/\/www.sheen.technology\/ru\/application\/industrial-power\/","title":{"rendered":"Industrial Power"},"content":{"rendered":"
\n
\nKey Application \u2022 Industrial Power<\/span>\n\n\n\n

Thermal Interface & Insulation Materials for Industrial Power Electronics<\/h1>\n\n\n\n

For UPS, AC-DC\/DC-DC power stages, inverters\/VFDs, and servo drives, Sheen materials help reduce interface thermal resistance.
improve electrical insulation safety, and enhance manufacturability (die-cut parts and automation-ready formats).
<\/p>\n\n\n\n

\nRequest Sample \/ RFQ<\/a>\n\n\n\nBrowse Materials<\/a>\n<\/div>\n\n\n\n

Recommended for: IGBT\/MOSFET\/SiC power modules, transformers\/inductors, control boards and heat sink interfaces.<\/p>\n<\/div>\n<\/section>\n\n\n\n

\n
\n

Design challenges in industrial power<\/h2>\n\n\n\n
\n
\n

High heat flux & hotspots<\/h3>\n\n\n\n

Power devices operate at high power density; interface thermal resistance directly impacts junction temperature margin.<\/p>\n\n\n\n

\nLow interface resistance<\/span>\n\n\n\nStable performance<\/span>\n<\/div>\n<\/div>\n\n\n\n
\n

Electrical insulation first<\/h3>\n\n\n\n

Dielectric strength and insulation reliability often become the key deciding factor for module-to-heat-sink interfaces.<\/p>\n\n\n\n

\nDielectric strength<\/span>\n\n\n\nSafety margin<\/span>\n<\/div>\n<\/div>\n\n\n\n
\n

Tolerance & manufacturability<\/h3>\n\n\n\n

Flatness and height variation require gap management; production needs die-cut parts or dispensable solutions for consistency.<\/p>\n\n\n\n

\nDie-cut<\/span>\n\n\n\nDispensing<\/span>\n\n\n\nRepeatability<\/span>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n\n\n\n
\n
\n

System map (where TIMs are applied)<\/h2>\n\n\n\n
\n
\n

UPS<\/h3>\n\n\n\n

Insulation + thermal transfer for power stages and heat sinks; focus on stability through thermal cycling.<\/p>\n\n\n\n

\nInsulation sheet<\/span>\n\n\n\nPads\/Gels<\/span>\n<\/div>\n<\/div>\n\n\n\n
\n

AC-DC \/ PFC Stage<\/h3>\n\n\n\n

IGBT\/MOSFET interfaces to cast aluminum or heat sinks; dielectric strength is often a critical requirement.<\/p>\n\n\n\n

\nInsulation<\/span>\n\n\n\nPCM\/Grease<\/span>\n<\/div>\n<\/div>\n\n\n\n
\n

DC-DC Converters<\/h3>\n\n\n\n

Complex gaps and height differences; automation-ready dispensing improves thickness and shape control.<\/p>\n\n\n\n

\nThermal gel<\/span>\n\n\n\nLow stress<\/span>\n<\/div>\n<\/div>\n\n\n\n
\n

Inverter \/ VFD<\/h3>\n\n\n\n

Power module interfaces require low thermal resistance and stable insulation; gap tolerance depends on the flatness stack-up.<\/p>\n\n\n\n

\nPads<\/span>\n\n\n\nPCM<\/span>\n<\/div>\n<\/div>\n\n\n\n
\n

Servo Drives<\/h3>\n\n\n\n

Board-to-housing conduction paths; prioritize controlled compression to protect PCB and packages.<\/p>\n\n\n\n

\nPads<\/span>\n\n\n\nTack options<\/span>\n<\/div>\n<\/div>\n\n\n\n
\n

Power Modules<\/h3>\n\n\n\n

IGBT\/SiC\/GaN module-level thermal path design; dielectric and reliability screening drive final selection.<\/p>\n\n\n\n

\nInsulation sheet<\/span>\n\n\n\nValidation<\/span>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n\n\n\n
\n
\n

Solutions by interface (engineer-ready)<\/h2>\n\n\n\n

Below are typical subsystem-level selections. <\/p>\n\n\n\n

\n
\n
\n
\n
Different project solutions require different model selections. Please consult our engineers to determine the appropriate product model.<\/strong><\/div>\n<\/div>\n\n\n\n
\u2013<\/div>\n<\/div>\n<\/div>\n\n\n\n
\n
\n
<\/div>\n\n\n\n

\nRecommended<\/span>\n\n\n\n Silicone-free thermal pads (AF series) for silicone-sensitive assemblies; Silicone pads (SF) where maximum conductivity\/temperature range is needed.<\/span>\n<\/p>\n\n\n\n