SR600-10 Graphite Sheet
The SR600-10 product has a unique layered structure and crystal orientation, and has good Thermal conductivity in the planar direction. This model is made of natural graphite, which can be die-cut into various shapes and wrapped around the edges to prevent the graphite from falling off and causing poor circuits.
Product Parameters
| SR600-10 | ||
| Item | Test | Test method |
| Protective film color | Black | Visual |
| Total thickness （mm) | 0.13±0.02 | ASTM D374 |
| Composition | Natural graphite | *** |
| Insulating adhesive tape | Optional | *** |
| Density (g/cm3) | 1.5±0.05 | ASTM D792 |
| Thermal Conductivity (W/m.k) | 300-500 | ASTM E1461 |
| Graphite content | ≥99% | *** |
| Tensile Strength（MPa) | ≥3.0 | *** |
| RoHS | PASS | IEC 62321 |
| Halogen | PASS | EN14582 |
| REACH | PASS | EN14372 |
| SR series Graphite Sheet | |||||
| Sheen Graphite Sheet | Thermal conductivity@XY(W/m.k) | Thermal conductivity@Z(W/m.k) | Total thickness | Ingredient | Insulating adhesive |
| SR600-A-W | 1500 | >30 | 0.065±0.003 | White PET film， graphite | Yes |
The SR600-10 product has a unique layered structure and crystal orientation, and has good Thermal conductivity in the planar direction. This model is made of natural graphite, which can be die-cut into various shapes and wrapped around the edges to prevent the graphite from falling off and causing poor circuits.
Applications
◆ Mobile phone
◆ Notebook
◆ TV
◆ Thermal module
◆ Router
◆ Notebook
◆ TV
◆ Thermal module
◆ Router
Principles of Thermal Interface Material
1. There are three modes of heat transfer: conduction, convection, and radiation.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
Thermal Interface Material(TIM)
