Product Portfolio
Discover an ever-expanding range of Thermally Conductive Materials solutions.
Resources
Here to assist you at every stage of the design journey.
Standard Density Silicone Foam
Balanced sealing & cushioning silicone
foam for general enclosures, equipment panels, and gasket tapes; closed-cell structure supports weather sealing and moisture resistance, with low compression set for long-term sealing.
foam for general enclosures, equipment panels, and gasket tapes; closed-cell structure supports weather sealing and moisture resistance, with low compression set for long-term sealing.
Density: 300–600 kg/m³
Thickness: 1.0–6.0 mm
Thickness: 1.0–6.0 mm
Low-Density Silicone
Foam
Foam
Ultra-soft sealing foam with low closure force for delicate housings and light-load sealing; closed -cell for water/
moisture sealing and ingress protection, with UL94 V-0 flame-retardant options.
moisture sealing and ingress protection, with UL94 V-0 flame-retardant options.
Density: <300 kg/m³
Thickness: 0.5–6.0 mm
Thickness: 0.5–6.0 mm
Ceramifiable / Fire
Barrier Silicone Foam
Barrier Silicone Foam
Ceramifiable silicone converts into a
rigid ceramic-like layer under flame/heat to block flame penetration and slow heat transfer—designed for EV batteries/ESS fire barrier and safety partitions; foam and ceramifiable silicone sheet solutions available.
rigid ceramic-like layer under flame/heat to block flame penetration and slow heat transfer—designed for EV batteries/ESS fire barrier and safety partitions; foam and ceramifiable silicone sheet solutions available.
Thickness (typ.): 4.2 ± 0.4
mmFlame Performance:
Cold side 140°C @600°C /5 min (2.0 mm)
mmFlame Performance:
Cold side 140°C @600°C /5 min (2.0 mm)
Silicone Thermal
Pad
Pad
● Supports Multiple Performance
Customizations: Color, hardness,
oil bleeding, siloxane volatility, options for glass fiber reinforcement, and adhesive backing
Customizations: Color, hardness,
oil bleeding, siloxane volatility, options for glass fiber reinforcement, and adhesive backing
Thermal Conductivity:
1.5~15.0 W/m·K
Thickness: 0.3~10.0 mm
1.5~15.0 W/m·K
Thickness: 0.3~10.0 mm
Carbon Fiber Thermal Pad
● Utilizing carbon fiber orientation
technology, achieving ultra-high thermal conductivity performance.
● Supports customization of high
resilience (HR) and high
compression (HC) versions
technology, achieving ultra-high thermal conductivity performance.
● Supports customization of high
resilience (HR) and high
compression (HC) versions
Thermal Conductivity:
15.0~45.0 W/m·K
Thickness: 0.3~12.0 mm
15.0~45.0 W/m·K
Thickness: 0.3~12.0 mm
Silicone-Free Thermal Pad
● No risk of silicone oil migration
or siloxane volatility.
● Excellent tensile strength and
abrasion resistance.
or siloxane volatility.
● Excellent tensile strength and
abrasion resistance.
Thermal Conductivity:
1.0~8.0 W/m·K
Thickness: 0.5~5.0 mm
1.0~8.0 W/m·K
Thickness: 0.5~5.0 mm
Phase Change Thermal Pad
● Phase Change Temperature
45~55°C.
● Low thermal impedance, good
wet-out properties, can replace
thermal grease, easy to handle.
● Optional PI film or Aluminum
Foil substrate.
45~55°C.
● Low thermal impedance, good
wet-out properties, can replace
thermal grease, easy to handle.
● Optional PI film or Aluminum
Foil substrate.
Thermal Conductivity:
1.8~8.0 W/m·K
Thickness: 0.13~0.5 mm
1.8~8.0 W/m·K
Thickness: 0.13~0.5 mm
Thermal
Film
Film
● Substrate Types:
1. Fiberglass (high mechanical
strength)
2. PI Film (high electrical insulation)
1. Fiberglass (high mechanical
strength)
2. PI Film (high electrical insulation)
Thermal Conductivity:
0.8~3.5 W/m·K
Thickness: 0.15~0.5 mm
0.8~3.5 W/m·K
Thickness: 0.15~0.5 mm
One-Part Thermal
Gel
Gel
● Non-Curing, with excellent wet
our properties and low thermal
impedance, does not crack or flow.
● Low assembly stress, suitable for
filling thin gaps in assemblies with
large thickness tolerances and
fragile components.
●Manual or automated dispensing
our properties and low thermal
impedance, does not crack or flow.
● Low assembly stress, suitable for
filling thin gaps in assemblies with
large thickness tolerances and
fragile components.
●Manual or automated dispensing
Thermal Conductivity:
2.0~10.0 W/m·K
2.0~10.0 W/m·K
Two-Part Thermal
Gel
Gel
● Room Temperature
Curing/Thermal Curing, cures to
an elastomer maintaining the
required thickness.
● Low assembly stress, suitable for
filling thin gaps in assemblies with
large thickness tolerances and
fragile components.
●Manual or automated dispensing
Curing/Thermal Curing, cures to
an elastomer maintaining the
required thickness.
● Low assembly stress, suitable for
filling thin gaps in assemblies with
large thickness tolerances and
fragile components.
●Manual or automated dispensing
Thermal Conductivity:
2.0~8.0 W/m·K
2.0~8.0 W/m·K
Thermal Grease
Series
Series
● Good wet-out properties,
minimal interfacial thickness of
0.05mm, extremely low thermal
impedance.
● No preheating required, suitable
for manual coating or screen
printing.
minimal interfacial thickness of
0.05mm, extremely low thermal
impedance.
● No preheating required, suitable
for manual coating or screen
printing.
Thermal Impedance:
0.04~0.015 ℃*in2/W
Thermal Conductivity:
1.0~5.0 W/m·K
0.04~0.015 ℃*in2/W
Thermal Conductivity:
1.0~5.0 W/m·K
Thermal Conductive Adhesive
● Room temperature curing with
excellent bonding, thermal
conductivity, and electrical
insulation properties.
● Long-term temperature
resistance.
excellent bonding, thermal
conductivity, and electrical
insulation properties.
● Long-term temperature
resistance.
Thermal Conductivity:
1.0~2.0 W/m·K
1.0~2.0 W/m·K
Thermal Potting Compound
● Room Temperature
Curing/Thermal Curing, cures to
an elastomer providing device
protection, insulation, and thermal
conductivity.
● Good flowability, self-leveling
Curing/Thermal Curing, cures to
an elastomer providing device
protection, insulation, and thermal
conductivity.
● Good flowability, self-leveling
Thermal Conductivity:
0.8~ 3.5 W/m·K
0.8~ 3.5 W/m·K