CSF 45 Carbon Fiber Thermal Pad 45.0W/mK
CSF45 Carbon Fiber Thermal Pad delivers 45.0 W/mK heat transfer in a soft, highly compressible, naturally tacky sheet that fills air gaps between hot components and heatsinks. Thickness 0.3–12.0 mm; low silicone oil bleed; die-cut shapes available; RoHS/Halogen/REACH compliant.
The CSF45 Carbon Fiber Thermal Pad is a high-conductivity, soft, and highly compressible gap filler designed to eliminate interfacial air and reduce contact thermal resistance between heat sources and heat spreaders/heatsinks. It features natural tackiness for easy placement and rework, as well as low silicone oil bleed for improved long-term stability in assemblies.
Quick Specs
Principles of Thermal Interface Material
1. There are three modes of heat transfer: conduction, convection, and radiation.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
Thermal Interface Material(TIM)
