Thermal Pad SF500FG 3.0W/mK
SF500 3.0 W/m·K thermal pad are used for filling the two contact surfaces. They are ultra soft and have good resilience, so effectively exclude air from the contact interface. The products are naturally tacky, can be die-cut into various shapes, easy to operate.
The SHEEN’s SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include:
◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K.
◆ Available in various thicknesses from 0.3 to 10.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K.
◆ Available in various thicknesses from 0.3 to 10.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
【Applications】
◆ Electric Vehicle Battery Management System
◆ CPU/GPU Chips
◆ Capacitors
◆ Memory/VRAM particles
◆ Control boards
◆ Splitters
◆ Relays
Properties
| Properties | Unit | SF500 | Test Method |
|---|---|---|---|
| Color | – | Blue | Visual |
| Thermal Conductivity | W/m·K | 3.0 | ASTM D5470 |
| Thermal Impedance (1mm,@30psi) | ℃*in2/W | 0.45 | ASTM D5470 |
| Thickness | mm | 0.3 ~ 10.0 | ASTM D374 |
| Standard Hardness | Shore 00 | 40/60 | ASTM D2240 |
| Customized Hardness | Shore 00 | 20 ~ 90 | ASTM D2240 |
| Elongation | % | 40 | ASTM D412 |
| Tensile Strength | psi | 30 | ASTM D412 |
| Density | g/cm3 | 2.9 | ASTM D792 |
| Dielectric Strength (@AC) | kV/mm | > 8 | ASTM D149 |
| Dielectric Constant (@1MHz) | – | 7.5 | ASTM D150 |
| Volume Resistivity | Ω·cm | 1*1013 | ASTM D257 |
| Operating Temp. | °C | -50 ~ 200 | – |
| Flame Rating | – | V-0 | UL94 |
| RoHS | – | PASS | IEC 62321 |
| Halogen | – | PASS | EN 14582 |
| REACH | – | PASS | EN 14372 |
Principles of Thermal Interface Material
1. There are three modes of heat transfer: conduction, convection, and radiation.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
2. When a chip is directly bonded to a heatsink, there exists a microscopic gap between the two interfaces. The thermal conductivity of the air in this gap is only 0.026W/m·K, which hinders heat conduction.
3. Thermal Interface Materials are used to fill the gaps between heat-generating components and heatsinks, eliminating the air at the interface and efficiently conducting heat.
Currently, SHEEN's SF series of Silicone Thermal Pad can achieve a thermal conductivity of 15W/m·K.
Thermal Interface Material(TIM)
